Foam Business

Foam Business

Electronics Applications

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One-stop solution

With a solid foundation in R&D, design, and manufacturing, Chiao Fu Group specializes in supplying foam applications for various cutting-edge industries.

Electronics Applications

For applications in the electronics industry, Chiao Fu can cover supply from cutting-edge wafer technology to consumer applications to achieve the effects of cushioning, shock absorption, lightweight, rebound, extension, and support.

Conductive foam

  • it can be combined with materials such as conductive fiber cloth to effectively provide electromagnetic wave shielding and conductive grounding functions.
  • it can be combined with conductive tape, conductive adhesive copper foil, aluminum foil, wave-absorbing material, and smt gasket to use the recovery force of the foam after compression and the force applied to the reverse endpoint, thereby producing a conductive effect and area shielding between the mechanisms.
  • it is used in electronic product i/o ports, electronic product shells, circuit board ground-side countermeasures, mechanism clearance, etc. and other emi (electromagnetic interference) and esd (electrostatic discharge) countermeasures.
信號屏蔽

signal shielding

信號屏蔽

electronic panel

Antistatic foam

01

good anti-static
properties

02

cushioning、
anti-collision、
shock absorption

03

low particle levels

04

applications:
automobiles、aircraft、
construction、
precision computers

Foam for electronics

  • foam for consumer electronics, headphones, stereos, etc.
  • it has been supplying car audio and professional audio drum paper for many years, and is designated for use by european car customers.
  • general cushioning and shock absorption during the manufacturing and transportation of precision electronic products.
耳機音響

headphone audio

緩衝包材

cushioning packaging material

Specifications

Item Model Density Hardness Application
conductive foam DH60 50 29 signal shielding
antistatic foam ES34 26 13 wafer industry
foam for electronics A286 14 9 electronic packaging materials
A228 12 9 electron blocking
C334 26 15 electronic packaging materials
Item conductive foam
Model DH60
Density 50
Hardness 29
Application signal shielding
Item antistatic foam
Model ES34
Density 26
Hardness 13
Application wafer industry
Item foam for electronics
Model A286
A228
C334
Density 14
12
26
Hardness 9
9
15
Application electronic packaging materials
electron blocking
electronic packaging materials

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CHIAO FU group provides you with the "most professional foam solution"